Udemy Advanced Materials For Electronics Packaging
Seeders : 0 Leechers : 9
| Torrent Hash : | 4A9E8828475FDB7957562F59675E57A7B66C100E |
| Torrent Added : | at Oct. 24, 2023, 2:06 p.m. in Other |
| Torrent Size : | 406.9 MB |
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Udemy Advanced Materials For Electronics Packaging
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Udemy Advanced Materials For Electronics Packaging
Get Bonus Downloads Here.url -
1. SELF INTRODUCTION.mp4 -
1. SELF INTRODUCTION.srt -
2. OVERVIEW OF COURSE CONTENTS.mp4 -
2. OVERVIEW OF COURSE CONTENTS.srt -
3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.mp4 -
3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.srt -
4. WHY DO WE NEED DEVICE PACKAGING COATING .mp4 -
4. WHY DO WE NEED DEVICE PACKAGING COATING .srt -
5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.mp4 -
5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.srt -
6. HIERARCHY OF ELECTRONICS PACKAGING.mp4 -
6. HIERARCHY OF ELECTRONICS PACKAGING.srt -
7. 3 PACKAGING VARIATIONS CARD DCAM MCML.mp4 -
7. 3 PACKAGING VARIATIONS CARD DCAM MCML.srt -
8. CONCEPT OF CHIP FIRST & CHIP LAST.mp4 -
8. CONCEPT OF CHIP FIRST & CHIP LAST.srt -
1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.mp4 -
1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.srt -
2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.mp4 -
2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.srt -
1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.mp4 -
1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.srt -
2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.mp4 -
2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.srt -
3. ELECTRONIC GLASS.mp4 -
3. ELECTRONIC GLASS.srt -
1. INTRODUCTION TO PCB.mp4 -
1. INTRODUCTION TO PCB.srt -
2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.mp4 -
2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.srt -
3. FR4 PCB BOARD.mp4 -
3. FR4 PCB BOARD.srt -
1. USE OF GELVET OVER CONVENTIONAL TIMs.mp4 -
1. USE OF GELVET OVER CONVENTIONAL TIMs.srt -
2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.mp4 -
2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.srt -
1. INTRODUCTION TO MMCs.mp4 -
1. INTRODUCTION TO MMCs.srt -
2. Al-DIAMOND MMC.mp4 -
2. Al-DIAMOND MMC.srt -
3. Al-SiC MMC.mp4 -
3. Al-SiC MMC.srt -
4. Al-Si MMC.mp4 -
4. Al-Si MMC.srt -
5. Cu-DIAMOND MMC.mp4 -
5. Cu-DIAMOND MMC.srt -
6. Al-GRAPHITE MMC.mp4 -
6. Al-GRAPHITE MMC.srt -
7. GOLD-GOLD INTERCONNECTION (GGI).mp4 -
7. GOLD-GOLD INTERCONNECTION (GGI).srt -
8. ROLE OF DIAMOND.mp4 -
8. ROLE OF DIAMOND.srt -
9. CARBON NANO TUBES (CNTs).mp4 -
9. CARBON NANO TUBES (CNTs).srt -
1. MATERIALS USED IN PCM.mp4 -
1. MATERIALS USED IN PCM.srt -
1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.mp4 -
1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.srt -
1.1 RESOURCE.pdf -
1. CONCLUSION.mp4 -
1. CONCLUSION.srt -
2. CLOSING SESSION.mp4 -
2. CLOSING SESSION.srt -
Bonus Resources.txt -
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Get Bonus Downloads Here.url -
176 bytes
1. SELF INTRODUCTION.mp4 -
6.1 MB
1. SELF INTRODUCTION.srt -
593 bytes
2. OVERVIEW OF COURSE CONTENTS.mp4 -
7.3 MB
2. OVERVIEW OF COURSE CONTENTS.srt -
1.4 KB
3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.mp4 -
20.9 MB
3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.srt -
2.7 KB
4. WHY DO WE NEED DEVICE PACKAGING COATING .mp4 -
12.6 MB
4. WHY DO WE NEED DEVICE PACKAGING COATING .srt -
1.3 KB
5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.mp4 -
10.5 MB
5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.srt -
1.3 KB
6. HIERARCHY OF ELECTRONICS PACKAGING.mp4 -
19.2 MB
6. HIERARCHY OF ELECTRONICS PACKAGING.srt -
1.9 KB
7. 3 PACKAGING VARIATIONS CARD DCAM MCML.mp4 -
11.4 MB
7. 3 PACKAGING VARIATIONS CARD DCAM MCML.srt -
1.3 KB
8. CONCEPT OF CHIP FIRST & CHIP LAST.mp4 -
8.9 MB
8. CONCEPT OF CHIP FIRST & CHIP LAST.srt -
703 bytes
1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.mp4 -
6.4 MB
1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.srt -
3.1 KB
2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.mp4 -
14.3 MB
2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.srt -
1.7 KB
1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.mp4 -
37.4 MB
1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.srt -
4.2 KB
2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.mp4 -
19.3 MB
2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.srt -
2.4 KB
3. ELECTRONIC GLASS.mp4 -
21.3 MB
3. ELECTRONIC GLASS.srt -
2.9 KB
1. INTRODUCTION TO PCB.mp4 -
9.3 MB
1. INTRODUCTION TO PCB.srt -
1023 bytes
2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.mp4 -
19.9 MB
2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.srt -
2.4 KB
3. FR4 PCB BOARD.mp4 -
5.6 MB
3. FR4 PCB BOARD.srt -
1.9 KB
1. USE OF GELVET OVER CONVENTIONAL TIMs.mp4 -
17.1 MB
1. USE OF GELVET OVER CONVENTIONAL TIMs.srt -
2.0 KB
2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.mp4 -
14.7 MB
2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.srt -
1.6 KB
1. INTRODUCTION TO MMCs.mp4 -
12.0 MB
1. INTRODUCTION TO MMCs.srt -
2.3 KB
2. Al-DIAMOND MMC.mp4 -
11.8 MB
2. Al-DIAMOND MMC.srt -
1.6 KB
3. Al-SiC MMC.mp4 -
11.1 MB
3. Al-SiC MMC.srt -
1.8 KB
4. Al-Si MMC.mp4 -
5.7 MB
4. Al-Si MMC.srt -
887 bytes
5. Cu-DIAMOND MMC.mp4 -
9.7 MB
5. Cu-DIAMOND MMC.srt -
1.5 KB
6. Al-GRAPHITE MMC.mp4 -
9.2 MB
6. Al-GRAPHITE MMC.srt -
1.0 KB
7. GOLD-GOLD INTERCONNECTION (GGI).mp4 -
14.3 MB
7. GOLD-GOLD INTERCONNECTION (GGI).srt -
1.3 KB
8. ROLE OF DIAMOND.mp4 -
14.9 MB
8. ROLE OF DIAMOND.srt -
1.8 KB
9. CARBON NANO TUBES (CNTs).mp4 -
17.7 MB
9. CARBON NANO TUBES (CNTs).srt -
2.0 KB
1. MATERIALS USED IN PCM.mp4 -
6.1 MB
1. MATERIALS USED IN PCM.srt -
2.5 KB
1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.mp4 -
9.6 MB
1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.srt -
849 bytes
1.1 RESOURCE.pdf -
3.9 MB
1. CONCLUSION.mp4 -
14.2 MB
1. CONCLUSION.srt -
1.5 KB
2. CLOSING SESSION.mp4 -
4.6 MB
2. CLOSING SESSION.srt -
819 bytes
Bonus Resources.txt -
357 bytes
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